3nm Chip Development. Based on a new report from Nikkei, a Chinese company, SMIC, is actively developing more advanced 3nm fabrication processes in-house, despite facing challenges acquiring key equipment due to the United States export sanctions.
SMIC is said to have already created new 2nd-generation 7nm fabrication techniques sufficient to produce smartphone processors. Now, SMIC aims to extend its capabilities even further to 5nm and 3 nm-class production methods through exclusive research.
SMIC’s technological progress flouts restrictions intended to pause the company from adopting processes beyond 7nm-class. Although the company’s speed is slowed, SMIC is overcoming obstacles through creative problem-solving.
Unable to obtain cutting-edge EUV lithography tools from ASML due to sanctions, SMIC has been relying on older DUV lithography to develop its 7nm technique. While less precise, SMIC enhances DUV embellishing through complex multi-exposure methods. This allows engraving finer feature sizes required for advanced nodes.
SMIC’s breakthrough in creating a DUV-based 3nm-class process demonstrates remarkable creativity and dedication. However, real-world results remain unproven. Mass production using homegrown methods may impact yields or product performance.
However, SMIC’s adaptability highlights China’s determination to build comprehensive domestic chip capabilities despite external impediments. Although the road ahead remains challenging, SMIC’s firm progress demands respect.
