Huawei P70 Specs Leaked. Huawei’s next flagship phone series, the P70, has seen several leaks recently that unveil key details about the devices ahead of any official announcement. Most notably, rumors point to the use of Huawei’s tried and tested Kirin 9000S chipset along with an upgraded camera system.
According to a post by tipster Smart Pikachu on Weibo, the standard Huawei P70 model will be powered by the 5nm-based Kirin 9000S. This octa-core SoC also fuels the latest Huawei Mate 60 phones with its configuration of 1 high-performance core, 3 performance cores, and 4 efficiency cores.
The tipster claims the P70 series may forego the popular 2K display resolution in favor of a slightly lower 1.5K panel. However, the displays could be curved on all sides for a seamless look.
In terms of optics, prominent leaker Digital Chat Station provided alleged rear panel renders showcasing a refreshed triple camera layout. The lenses are placed in a corner-aligned triangular housing within a large pill-shaped camera bump.
DCS states the main shooter will feature a variable aperture mechanism alongside a periscope lens for extended zoom capability. Unfortunately, key specifications like megapixel counts or sensors remain unclear for now.
The render does confirm Huawei’s XMAGE branding for the phone’s image processing, as seen on other recent devices from the brand. This points to improvements in photography being a highlight of the P70 series.
With the Kirin 9000S providing plenty of power alongside faster 5G connectivity and improved cameras, the Huawei P70 shapes up to be a formidable flagship phone. The spec sheet may not match the extremes we’ve seen on some Android alternatives, but it remains competitive nonetheless.
Fans can expect more leaks in the near future as we approach the rumored late 2024 launch timeline for the P70 series. For now, mark your calendars for an exciting new set of flagship phones as Huawei continues pushing technological boundaries despite sourcing challenges over the past few years.
